89 lines
3.2 KiB
ReStructuredText
Executable File
89 lines
3.2 KiB
ReStructuredText
Executable File
Software Architecture
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---------------------
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:link_to_translation:`zh_CN:[中文]`
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Summary
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*******
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Armino software is divided into middleware layer, component layer and application layer.
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Armino Armino abstracts the coupling dependence of software on hardware platform and realizes
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the shelving of software platform. Through this shelf design and rich SDK APIs, SDK developers
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can design and develop more efficiently.
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.. figure:: ../../../_static/armino_architecture.png
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:align: center
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:alt: Architecture Overview
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:figclass: align-center
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Architecture Overview
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Software Architecture
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*********************
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Armino SDK can flexibly support different product software architectures.
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1、 Based on Armino SDK's own software architecture
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See the legend of Architecture Overview for the overall framework of the solution.
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In this solution, the operating system has been decoupled and adapted.
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The current Armino solution supports FreeRTOS and LiteOS.
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2、 Based on the developer's own software architecture
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Armino SDKThe Armino SDK is compatible with a variety of software ecosystems,
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facilitating developers to integrate the Armino chip solution into their own
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mature product software architecture.
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.. figure:: ../../../_static/armino_os_solution.png
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:align: center
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:alt: Armino OS solution
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:figclass: align-center
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Armino OS solution
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.. figure:: ../../../_static/armino_custiomer_solution.png
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:align: center
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:alt: Armino customer solution
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:figclass: align-center
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Armino customer solution
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Hardware Layer
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**************
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Hardware layer, namely hardware layer, refers specifically to the hardware of BEKEN solution.。
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Middleware Layer
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****************
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Middleware layer, namely the middle layer, is an abstract layer for the underlying hardware and
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upper components. Through the M-server, we can seamlessly switch between different solutions.
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.. figure:: ../../../_static/armino_middleware.png
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:align: center
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:alt: Armino middleware
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:figclass: align-center
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Armino middleware
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As shown in the figure:：
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- arch, It includes related functions of chip architecture, such as arm, riscv, general interrupt processing, boot, pmp, etc.
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- soc, Chip related special processing and related configuration.
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- dirver, Driver layer, including various peripheral drivers, such as I2C, GPIO, UART, etc.
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- compal, Components abstraction layer. In order to enable third-party open source components to function on the armono platform while reducing code coupling.
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- boards, Board level configuration is related, covering some engineering configurations of specific projects.
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Component Layer
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***************
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The Components layer, or component layer, is a service component that contains many third-party open source or self developed by armono. Developers can configure defconfig in the middleware layer to switch related component services.
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Application Layer
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*****************
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The application layer is organized under the projects directory, and the last level of the CmakeList directory is the building entry for a complete solution. It carries the differentiation of different projects and the configuration set of different product solutions. |